Asetek will showcase its latest energy saving data center liquid cooling solutions at the International Supercomputing Conference (ISC’13) in Leipzig, Germany – June 17-20, 2013. These solutions, the RackCDU™ and In-Server Air Conditioning (ISAC), provide data centers with cooling cost reductions exceeding 80%, density increases of 2.5x, and the ability to recycle up to 80% of their waste heat. Presentations and live demonstrations will be available at Asetek’s booth #271.
“The combination of financial and political forces makes Europe a strong market for Asetek liquid cooling,” said Steve Branton, Asetek’s Senior Director of Marketing for the Data Center Business Unit. “The solutions that we are showing at ISC’13 reflect our continued innovation in bringing energy efficiency to both small and large data centers.”
Asetek will highlight its direct-to-chip (D2C) RackCDU™ hot-water liquid cooling system with prototype servers from HP, Cisco and Fujitsu. In addition, Cray’s supercomputer CS300-LC with RackCDU will be on display. RackCDU is a hot water, direct-to-chip, data center liquid cooling system that enables cooling energy savings of up to 80% and density increases of 2.5x when compared to modern air cooled data centers. RackCDU removes heat from CPUs, GPUs, memory modules and other hot spots within servers and takes it out of the data center using liquid where it can be released for free using outside air, or recycled to generate building heat and hot-water. RackCDU is currently available for deployment.
This does sound cool, power and cooling continue to be challenges as we scale up the infrastructure, do check this out, I wonder if we might see further interest and innovation from their hot-water liquid cooling solution. I’m off to read more.