Broadcom continues to innovate the wired and wireless worlds
IRVINE, Calif., April 30, 2012 /PRNewswire/ –
News Highlights:
- World’s highest density SoC and FE1600 fabric enable highly scalable 10/40/100G solutions
- Only merchant silicon to process a single stream of 200Gbps supporting two 100Gbps full-duplex ports
- Combines fabric/network interfaces, packet processor and traffic manager on a single chip
- Unparalleled integration reduces board space, power and system cost
Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today introduced the BCM88650 series, the world’s highest density 100 gigabit Ethernet (GbE) switching solution, enabling the design of switching platforms with densities up to 4,000 100GbE ports. With the industry’s highest level of integration, the BCM88650 system on chip (SoC) combines the features and functionality of a complete line card into a single chip. Together with Broadcom’s leading FE1600 (BCM88750) fabric, the BCM88650 SoC enables a new generation of high density networking solutions exceeding 100 terabits per second (Tbps). See the technology in action at INTEROP 2012 or visit http://go.broadcom.com/interop12 to learn more.
Anything the different networks vendors (including Broadcom) can do to improve the scalability of the underlying network infrastructure has to be a good thing particular as we see demand for connectivity, for rich media and continue to rise year on year as data requirements and growth of online working, online data storage extend beyond the traditional consumer into the smb and enterprise markets where latency, reliability and scalability are key.
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