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Announcing the next generation cooling solution

The Hot Aisle

Next week, Iceotope will announce that it has developed, patented and manufactured an extreme IT equipment cooling solution.  The solution tackles the problems of cooling servers in data centres all the way from the actual source of the heat – at the processor and memory component level – to its final destination – outside air by using a 100% liquid path, some 4000 times more efficient than air.

The system operates at an amazing PUE of just over 1 and can operate almost everywhere on the planet without refrigeration. It is silent, reliable and can house the very highest performance systems with the highest power parts at extreme density. If you plan to visit Supercomputing next week in Portland Oregon you can see the product on Booth 2355.

The heat produced by the components inside each server is captured effectively by immersing the server motherboards in individually sealed baths of an inert synthetic liquid coolant. With the heat now locked in to a liquid, subsequent stages of liquid (water) cooling can be implemented to efficiently transport the heat from source to final destination in the air outside the data centre as shown below.

How cool is this? Check out this article on the hot aisle, (one of the blogs I regularly check out). It’s great to see further innovation in the cooling space, being able to have a server that doesn’t need as stringent cooling or environmental conditions creates not only new opportunities and possibly new market places, it could reduce the operating and support costs significantly. I’m off to read up more about it.

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